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Cinch connectivity solutions 26482 series connectors
Cinch's "MS" series connectors are not just meeting but exceeding the requirements for MIL-C-26482 Series I Solder qualification, earning their spot on the U.S. Government's Qualified Product List. With nine shell sizes and over thirty insert arrangements, featuring pin or socket contacts, these connectors offer versatility like never before.
Converge achieves ISO/IEC 17025:2017 and AS6171 accreditations
Converge, an Arrow company, has it received ISO/IEC 17025:2017 accreditation including AS6171 general requirements and applicable slash sheets.
Vishay selects Aixtron SiC multiwafer batch technology
Aixtron's G10-SiC epitaxy production platform has been chosen by Vishay Intertechnology, to empower the company’s in-house SiC epitaxy needs for power device manufacturing.
Trymax receives multi-system orders from Asian foundry
Trymax Semiconductor Equipment (Trymax), a provider of plasma solutions, has received multi-system orders for its NEO 2400 series and NEO 2000UV from an unnamed large Asia-based foundry.
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A reliable European distributor
When is the most critical phase in the launch of a new electronic product? Is it development, which regularly takes place under great time and cost pressure? Or is it the transition to series production, when large quantities of components have to be delivered quickly - with precisely specified characteristics and exact timing? Each of these phases confronts companies with its own challenges. The support of a competent and reliable distributor often makes all the difference.
Axcelis ships multiple systems to SiC chipmakers
Axcelis Technologies announces multiple shipments of the Purion Power Series ion implanter systems to silicon carbide (SiC) power device chipmakers worldwide.
Tampere University secures EU funding for semiconductor pilot line
On 11 April, the Public Authorities Board of the Chips Joint Undertaking selected four pilot production lines for semiconductor chips that will receive funding from the EU. The selected pilot line in Finland will be set up by Tampere University and the VTT Technical Research Centre of Finland.
Wolfspeed selects Aixtron tools to support 200mm production
SiC specialist Wolfspeed has placed multiple-tool orders in Q3 and Q4 2023 to utilise Aixtron's G10-SiC to help further ramp production for 200mm (8-inch) SiC epitaxial wafers.
Samsung to receive $6.4B Chips Act boost for Texas fab
The Biden administration will award Samsung Electronics with up to USD 6.4 billion in direct funding to expand the company's semiconductor production in Texas as part of the CHIPS and Science Act.
R2 Semiconductor files lawsuit against Intel in France
R2 Semiconductor has filed a patent infringement lawsuit in Le Tribunal Judiciaire de Paris against the French subsidiaries of Intel and its customers, Dell Technologies and Hewlett Packard Enterprise Company and HP Inc.
FPT says its “all In” on AI, automotive and semiconductors
FPT Corporation has unveiled its strategic directions for the 2024-2026 period, with five focused areas defined as AI, Automotive, Semiconductor, Digital Transformation, and Green Transformation.
ODU names new managing director
Connector solutions manufacturer ODU has appointed Dr. Henner Spelsberg as its new Managing Director and Spokesman of the Management Board. He will assume the responsibilities of his predecessor, Dr.-Ing. Kurt Woelfl.
IT breach at Nexperia
Nexperia says that it has become aware that an unauthorised third party accessed certain of its IT servers in March 2024.
Exyte acquires Kinetics Group
Exyte says it plans to acquire Kinetics Group, a global provider of installation services, equipment, as well as technical facility management.
Qualcomm drops bid to buy Autotalks
Qualcomm has terminated its deal to acquire Israeli V2X communications company Autotalks.
ERS and Geringer to strengthen R&D and production capabilities
ERS electronic, a thermal management solutions specialist for semiconductor manufacturing, has finalised an agreement with Geringer Halbleitertechnik GmbH & Co. KG, a move poised to bolster its R&D and production capabilities.
JDI completes the sale of Higashiura fab to Sony
Back in March last year, Japan Display Inc (JDI) announced that it was going to sell its Higashiura fab facilities. The company has now completed the sale of the former Higashiura fab facilities to Sony Semiconductor Manufacturing Corporation (SCK).
Microchip acquires Neuronix AI Labs
Microchip Technology has acquired Neuronix AI Labs to expand its capabilities for power-efficient, AI-enabled edge solutions deployed on field programmable gate arrays (FPGAs).
Kyocera AVX breaks ground on new facility
Kyocera AVX new 49,000-square-foot manufacturing and design center will allow the company to produce millions of precision timing and frequency control products.
Apple to supercharge Mac range with AI-optimised M4 chip
Apple is preparing for a major overhaul of its laptop and desktop line-up by powering them with its new M4 chipset, which prioritises AI applications.
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PCBs: price reduction of up to -50.3% through AI
Thanks to the increased use of AI in production preparation, Multi-CB, a leading European PCB specialist, has been able to permanently reduce the prices for 1- and 2-layer PCBs. The price for a half Eurocard (80x100mm), for example, is now € 14.80 instead of € 29.80. Due to the process, the price reduction has the most significant effect on small quantities, although medium quantities are also benefiting.
Arm, Intel Google and Meta launch self-designed AI chips
The future direction for dominance in the AI chip space took another turn this week as four huge stakeholders revealed their own products.
LG Electronics expands home appliance AI chip range
Korea's LG Electronics is set to extend its appliance-specific on-device AI chip, DQ-C, to 46 models by the end of the year.
Siltronic ends wafer production for "small diameters"
Siltronic plans to gradually cease production of polished and epitaxial small diameter wafers at its Burghausen site. The process, which excludes unpolished wafers, is set to be completed in 2025.
Microchip acquires VSI
Microchip Technology has completed the acquisition of Seoul, Korea-based VSI Co. Ltd., a specialist in providing high-speed, asymmetric, camera, sensor and display connectivity technologies and products based on the Automotive SerDes Alliance (ASA) open standard for In-Vehicle Networking (IVN).
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